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lite-on dcc release bns-od-fc001/a4 lite-on technology corp. / optoelectronics no.90,chien 1 road, chung ho, new taipei city 23585, taiwan, r.o.c. tel: 886-2-2222-6181 fax: 886-2-2221-1948 / 886-2-2221-0660 http://www.liteon.com/opto through hole lamp product data sheetLTL17KCGM4J-0G1A spec no. :ds20-2017-0026effective date: 05/19/2017 revision: -
1 / 10 part no. : ltl17kcgm4j - 0 g1 a bns-od-fc002/a4 through hole lamp LTL17KCGM4J-0G1A through hole lamp LTL17KCGM4J-0G1A rev description by date p001 preliminary spec (rdr-20150008) strong 01/14/2 015 p002 white diffused lens correction strong 01/16/20 15 p003 hue 518nm at 20ma, add hue-current diagram strong 02/03/2015 p004 add iv st bin strong 02/09/2015 p005 update package dimensions on page 5 jeromy 06/12/2015 p006 update package dimensions on page 2 norah 01/04/201 7 above data for pd and customer tracking only - nppr received and upload on opnc nareerat 03/03/2017
2 / 10 part no. : ltl17kcgm4j - 0 g1 a bns-od-fc002/a4 through hole lamp LTL17KCGM4J-0G1A 1. description through- hole leds are offered in a variety of packages such as 3mm, 4mm, 5mm, rectangular, and cylinder which are suitable for all applications requiring status indication. s everal intensity and viewing angle choices are available in each color for design flexibility. 1. 1. features low power consumption & high efficiency lead free & rohs compliant popular t-1 diameter green ingan 518nm lamp & white diffused lens 1.2. applications communication computer consumer home appliance industrial 2. outline dimensions notes : 1. all dimensions are in millimeters (inches). 2. tolerance is 0.25mm (.010") unless otherwise noted . 3. protruded resin under flange is 1.0mm (.04") max. 4. lead spacing is measured where the leads emerge fro m the package. 5. specifications are subject to change without notice .
3 / 10 part no. : ltl17kcgm4j - 0 g1 a bns-od-fc002/a4 through hole lamp LTL17KCGM4J-0G1A 3. absolute maximum ratings at ta=25c parameter maximum rating unit power dissipation 108 mw peak forward current (1/10 duty cycle, 0.1ms pulse width) 100 ma dc forward current 30 ma derating linear from 30 0.45 ma/c operating temperature range -30c to + 85c storage temperature range -40c to + 100c lead soldering temperature [2.0mm (.079") from body] 260c for 5 seconds max. 4. electrical / optical characteristics at ta=25c parameter symbol min. typ. max. unit test condition luminous intensity iv 680 3200 mcd if = 20ma note 1,5 viewing angle 2 1/2 40 deg note 2 (fig.6) peak emission wavelength p 515 nm measurement @peak (fig.1) dominant wavelength d 514 518 527 nm note 4 spectral line half-width ? 35 nm forward voltage vf 2.9 3.2 3.6 v if = 20ma reverse current ir 10 a vr = 5v note: 1. luminous intensity is measured with a light sens or and filter combination that approximates the cie eye-response curve. 2. 1/2 is the off-axis angle at which the luminous int ensity is half the axial luminous intensity. 3. iv classification code is marked on each packing bag. 4. the dominant wavelength, d is derived from the cie chromaticity diagram and represents the single wavelength which defines the color of the device. 5. iv guarantee must be included with 15% testing tolerance. 6. reverse voltage (vr) condition is applied for ir test only. the device is not designed for reverse operation.
4 / 10 part no. : ltl17kcgm4j - 0 g1 a bns-od-fc002/a4 through hole lamp LTL17KCGM4J-0G1A 5. typical electrical / optical characteristics cur ves (25 c ambient temperature unless otherwise noted)
5 / 10 part no. : ltl17kcgm4j - 0 g1 a bns-od-fc002/a4 through hole lamp LTL17KCGM4J-0G1A 6. taping features * compatible with radial lead automatic insertion e quipment. * most radial lead plastic lead lamps available pac kaged in tape and folding. * 2.54mm (0.1") straight lead spacing available. * folding packaging simplifies handling and testing . * reel packaging is available by removing suffix a on option. * ammo packing series lamp type 24 led+gap. package dimensions specification item symbol minimum maximum mm inch mm inch tape feed hole diameter d 3.8 0.149 4.2 0.165 component lead pitch f 4.8 0.188 5.8 0.228 front to rear deflection h -- -- 2.0 0.078 height of seating plane h 15.5 0.610 16.5 0.649 feed hole to bottom of component h1 20.0 0.787 22.0 0.866 feed hole to overall component height h2 25.1 0.988 27.7 1.091 lead length after component height l w0 11.0 0.433 feed hole pitch p 12.4 0.488 13.0 0.511 lead location p1 3.15 0.124 4.55 0.179 center of component location p2 5.05 0.198 7.65 0.301 total tape thickness t -- -- 0.90 0.035 feed hole location w0 8.5 0.334 9.75 0.384 adhesive tape position w2 0 0 3.0 0.118 tape width w3 17.5 0.689 19.0 0.748
6 / 10 part no. : ltl17kcgm4j - 0 g1 a bns-od-fc002/a4 through hole lamp LTL17KCGM4J-0G1A 7. packing spec. total 3,000pcs per inner carton 10 inner cartons per outer carton total 30,000 pcs per outer carton in every shipping lot, only the last pack will be non-full packing
7 / 10 part no. : ltl17kcgm4j - 0 g1 a bns-od-fc002/a4 through hole lamp LTL17KCGM4J-0G1A 8. bin table specification luminous intensity unit : mcd @20ma bin code min. max. np 680 1150 qr 1150 1900 st 1900 3200 note: tolerance of each bin limit is 15% dominant wavelength unit : nm @20ma bin code min max g07 514.0 516.0 g08 516.0 518.0 g09 518.0 520.0 g10 520.0 523.0 g11 523.0 527.0 note: tolerance of each bin limit is 1nm
8 / 10 part no. : ltl17kcgm4j - 0 g1 a bns-od-fc002/a4 through hole lamp LTL17KCGM4J-0G1A 9. cautions 9.1. application this led lamp is good for application of indoor and outdoor sign, also ordinary electronic equipment. 9.2. storage the storage ambient for the leds should not exceed 30c temperature or 70% relative humidity. it is re commended that leds out of their original packaging are used withi n three months. for extended storage out of their o riginal packaging, it is recommended that the leds be stored in a sealed con tainer with appropriate desiccant or in desiccators with nitrogen ambient. 9.3. cleaning use alcohol-based cleaning solvents such as isoprop yl alcohol to clean the leds if necessary. 9.4. lead forming & assembly during lead forming, the leads should be bent at a point at least 3mm from the base of led lens. do no t use the base of the lead frame as a fulcrum during forming. lead formin g must be done before soldering, at normal temperat ure. during assembly on pcb, use minimum clinch force possible to avoid excessive mechanical stress. 9.5. soldering when soldering, leave a minimum of 2mm clearance fr om the base of the lens to the soldering point. dip ping the lens into the solder must be avoided. do not apply any external s tress to the lead frame during soldering while the led is at high temperature. recommended soldering conditions: soldering iron wave soldering temperature soldering time position 350c max. 3 seconds max. (one time only) no closer than 2mm from the base of the epoxy bulb pre-heat pre-heat time solder wave soldering time dipping position 100c max. 60 seconds max. 260c max. 5 seconds max. no lower than 2mm from the base of the epoxy bulb note: excessive soldering temperature and/or time m ight result in deformation of the led lens or catas trophic failure of the led. ir reflow is not suitable proce ss for through hole type led lamp product. 9.6. drive method an led is a current-operated device. in order to en sure intensity uniformity on multiple leds connecte d in parallel in an application, it is recommended that a current limit ing resistor be incorporated in the drive circuit, in series with each led as shown in circuit a below. circuit model (a) circuit model (b) led led (a) recommended circuit (b) the brightness of each led might appear differe nt due to the differences in the i-v characteristic s of those leds.
9 / 10 part no. : ltl17kcgm4j - 0 g1 a bns-od-fc002/a4 through hole lamp LTL17KCGM4J-0G1A 9.7. esd (electrostatic discharge) static electricity or power surge will damage the l ed. suggestions to prevent esd damage: use a conductive wrist band or anti- electrostatic glove when handling these leds all devices, equipment, and machinery must be prop erly grounded work tables, storage racks, etc. should be properl y grounded use ion blower to neutralize the static charge whi ch might have built up on surface of the leds plast ic lens as a result of friction between leds during st orage and handing suggested checking list: training and certification 9.7.1.1. everyone working in a static-safe area is esd-certified? 9.7.1.2. training records kept and re-certific ation dates monitored? static-safe workstation & work areas 9.7.2.1. static-safe workstation or work-areas have esd signs? 9.7.2.2. all surfaces and objects at all stati c-safe workstation and within 1 ft measure less tha n 100v? 9.7.2.3. all ionizer activated, positioned toward s the units? 9.7.2.4. each work surface mats grounding is g ood? personnel grounding 9.7.3.1. every person (including visitors) han dling esd sensitive (esds) items wear wrist strap, heel strap or conductive shoes with conductive flooring? 9.7.3.1. if conductive footwear used, conductive flooring also present where operator stand or walk? 9.7.3.2. garments, hairs or anything closer th an 1 ft to esd items measure less than 100v*? 9.7.3.3. every wrist strap or heel strap/condu ctive shoes checked daily and result recorded for a ll dls? 9.7.3.4. all wrist strap or heel strap checker s calibration up to date? note: *50v for blue led. device handling 9.7.4.1. every esds items identified by eia-47 1 labels on item or packaging? 9.7.4.2. all esds items completely inside prop erly closed static-shielding containers when not at static-safe workstation? 9.7.4.3. no static charge generators (e.g. pla stics) inside shielding containers with esds items? 9.7.4.4. all flexible conductive and dissipati ve package materials inspected before reuse or recy cle? others 9.7.5.1. audit result reported to entity esd co ntrol coordinator? 9.7.5.2. corrective action from previous audit s completed? 9.7.5.3. are audit records complete and on file ?
10 / 10 part no. : ltl17kcgm4j - 0 g1 a bns-od-fc002/a4 through hole lamp LTL17KCGM4J-0G1A 10. reliability test classification test item test condition sample size reference standard endurance test operation life ta = under room temperature if = per datasheet maximum drive current test time= 1000hrs 22 pcs (cl=90%; ltpd=10%) mil-std-750d:1026 (1995) mil-std-883g:1005 (2006) high temperature high humidity storage ta = 60c rh = 90% test time= 240hrs 22 pcs (cl=90%; ltpd=10%) mil-std-202g:103b (2002) jeita ed-4701:100 103 (2001) high temperature storage ta= 105 5c test time= 1000hrs 22 pcs (cl=90%; ltpd=10%) mil-std-750d:1031 (1995) mil-std-883g:1008 (2006) jeita ed-4701:200 201 (2001) low temperature storage ta= -55 5c test time= 1000hrs 22 pcs (cl=90%; ltpd=10%) jeita ed-4701:200 202 (2001) environmental test temperature cycling 100c 25c -40c 25c 30mins 5mins 30mins 5mins 30 cycles 22 pcs (cl=90%; ltpd=10%) mil-std-750d:1051 (1995) mil-std-883g:1010 (2006) jeita ed-4701:100 105 (2001) jesd22-a104c (2005) thermal shock 100 5c -30c 5c 15mins 15mins 30 cycles (<20 secs transfer) 22 pcs (cl=90%; ltpd=10%) mil-std-750d:1056 (1995) mil-std-883g:1011 (2006) mil-std-202g:107g (2002) jesd22-a106b (2004) solder resistance t.sol = 260 5c dwell time= 101 seconds 3mm from the base of the epoxy bulb 11 pcs (cl=90%; ltpd=18.9%) mil-std-750d:2031(1995) jeita ed-4701: 300 302 (2001) solderability t. sol = 245 5c dwell time= 5 0.5 seconds (lead free solder, coverage R 95% of the dipped surface) 11 pcs (cl=90%; ltpd=18.9%) mil-std-750d:2026 (1995) mil-std-883g:2003 (2006) mil-std-202g:208h (2002) ipc/eia j-std-002 (2004) soldering iron t. sol = 350 5c dwell time= 3.5 0.5 seconds 11 pcs (cl=90%; ltpd=18.9%) mil-std-202g:208h (2002) jeita ed-4701:300 302 (2001) 11. others the appearance and specifications of the produ ct may be modified for improvement, without prior n otice.

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